Send Message
Home ProductsPolyamide Resin For Printing Inks

Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

Customer Reviews
Chris, the quality and service from your company are very good! Glad to do business with you!

—— Jimmy

Hi, Christopher! To cooperate with your company is my honor! Reasonable price and considerate service!

—— Bob Rogers

We have received your resins, the package looks very good! Thanks for your support and help!

—— Carol

The performance of your resin is very excellent in our inks, and the compatability is also good! We are sure to purchase from your company!

—— Susan

I'm Online Chat Now

Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package
Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

Large Image :  Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

Product Details:
Place of Origin: China
Brand Name: Direction Chemical
Certification: ISO9001
Model Number: DY-P404
Payment & Shipping Terms:
Minimum Order Quantity: 500Kgs
Price: USD2.90~3.90/Kg
Packaging Details: 25Kgs/bag
Delivery Time: 5-8 working days
Payment Terms: D/A, L/C, D/P, T/T
Supply Ability: 1000T/month

Round Grain Polyamide Hot-Melt Adhesive Hemming Adhesive DY-P404 For Package

Description
Acid Value: ≤5mg KOH/g Amine Value: ≤3mg KOH/g
Viscosity: 10000-20000mpa.s/200ºC Softening Point: 120±5ºC
Color,(Fe-Co): ≤8 Tensile Strength: ≥20 MPa
Water Absorption: ≤ 0.4% Shear Strength: ≥11 MPa, AL/AL
Stretch Rate: ≥800 % Peeling Strength: ≥ 100N/25mm,PE/PE,60±2ºC
Operating Temperature: 160-200ºC
High Light:

Round Grain Polyamide Hot Melt Adhesive

,

Polyamide Resin Hemming Adhesive

,

Package Polyamide Hemming Adhesive

Polyamide Hot-melt Adhesive/Hemming Adhesive (DY-P404)

 

1.Appearance:

      Yellowish round grain with schistose shape

 

2.Property:

DY-P404 is a general type of polyamide hot-melt adhesive, which is made from dimer acid and polyamine through condensation reaction at high temperature.

It can dissolve in general organic solvents, the hot-melting viscosity of the resin is greatly related to the temperature that it gets.

The polyamide hot-melt adhesive possesses the following advantages, such as lower viscosity, good fluidity, good flexibility, high adhesive strength, good media corrosion resistance, good solubility and fluxing property at low temperature, higher heat stability etc.

 

3.Application

This type of resin is applied in heat-shrinkable sleeve for electric cable, sealing material for electrical connection, cementing or fixing materials for electronic component, bonding material for package, textile, leather, wood, plastic, metal and ceramics etc.

 

4.Technologic Index

Acid Value,(mg KOH/g ≤) 5
Amine Value,(mg KOH/g≤) 3
Viscosity,(mpa.s/200ºC) 10000-20000
Softening Point,(ºC) 120±5
Color,(Fe-Co ≤) 8
Tensile Strength, (≥ MPa) 20
Water absorption, (≤ %) 0.4
Shear Strength, (≥ MPa, AL/AL) 11
Stretch Rate, (≥ %) 800

Peeling strength,

(≥ N/25mm,PE/PE,60±2ºC)

100
Operating Temperature( ºC ) 160-200
 
 
5.Packaging & Storage

Double packing: PP textile bag lined with PE film or paper-plastic composite bag lined with PE film.

Net weight is 25Kgs per bag.

Store in cool, airy and dry place, the package has to be sealed before using up the resins.

Contact Details
Suzhou Direction Chemical Co.,Ltd

Contact Person: Mr. Christopher Cao

Tel: +8613063757966

Send your inquiry directly to us (0 / 3000)