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Hot melt polyamide adhesive Used In Cementing Or Fixing Materials For Electronic Component

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Hot melt polyamide adhesive Used In Cementing Or Fixing Materials For Electronic Component

Hot melt polyamide adhesive Used In Cementing Or Fixing Materials For Electronic Component
Hot melt polyamide adhesive Used In Cementing Or Fixing Materials For Electronic Component Hot melt polyamide adhesive Used In Cementing Or Fixing Materials For Electronic Component

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Product Details:
Place of Origin: China
Brand Name: Direction Chemical
Model Number: DY-P402
Payment & Shipping Terms:
Minimum Order Quantity: 200Kgs
Price: USD2.25~3.25/Kg
Packaging Details: Craft paper bag lined with PP film, 25Kgs/bag
Delivery Time: 10 working days after receiving the payment
Payment Terms: T/T, L/C, Westernunion
Supply Ability: 1,000MTs/month
Detailed Product Description
Product Name: Hot Melt Adhesive Appearance: Yellowish Granule
Operating Temperature: 140-160 ºC Viscosity: 1000-2500mpa.s
Softening Point: 120±5 ºC HS Code: 3506911000
High Light:

polyamide hot melt

,

hot melt polyamide

DY-P402 Hot melt adhesive Used In Cementing Or Fixing Materials For Electronic Component

 

 

Specifications:

Acid Value,(mg KOH/g ≤) 5
Amine Value,(mg KOH/g≤) 3
Viscosity,(mpa.s/200ºC) 2500-4500
Softening Point,(ºC) 110±5
Color,(Fe-Co ≤) 8
Tensile Strength, (≥ MPa) 6
Water absorption, (≤ %) 0.4
Shear Strength, (≥ MPa, AL/AL) 7
Stretch Rate, (≥ %) 400

Peeling strength,

(≥ N/25mm,PE/PE,60±2ºC)

100
Operating Temperature( ºC ) 140-160
 
 
Appearance:

Yellowish granule with schistose shape

 

Property:

DY-P401 has high performance, which is made from dimer acid and polyamine, it can dissolve in general organic solvents, the hot-melting viscosity of the resin is greatly related to the temperature that it gets.

This polyamide hot-melt adhesive possesses the following advantages, such as lower viscosity, good fluidity, good flexibility, high adhesive strength, good media corrosion resistance, good solubility and fluxing property at low temperature, higher heat stability etc.

 

Applications:

heat-shrinkable sleeve for electric cable, sealing material for electrical connection, cementing or fixing materials for electronic component;

bonding material for package, textile, leather, wood, plastic, metal and ceramics etc.

 

Packaging and Storage:

craft paper-plastic composite bag;

25Kgs per bag;

kept in cool, airy and dry place;

keep the package sealed.

Hot melt polyamide adhesive Used In Cementing Or Fixing Materials For Electronic Component 0

Contact Details
Suzhou Direction Chemical Co.,Ltd

Contact Person: Mr. Christopher Cao

Tel: +8613063757966

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